Nov 27 2020

3D for Packaging Round Table

27 Nov 2020 02:00PM to 27 Nov 2020 04:00PM
SMF Building, Classroom 1.4-1.6

Registration Date

 :

17 Nov 2020 09:00AM to 27 Nov 2020 12:00PM

SMF Member Fee

 :

$0.00

GS1 Member Fee

 :

$0.00

Non-Member Fee

 :

$0.00

Event Details

Event Type

 :

Seminars and Events

Industry Group

 :

Packaging Council of Singapore

Contact Person

 :

Kwok Keong Choi

Synopsis

 3D for Packaging Round Table 


Imagine you can redesign lighter end effector that enable packaging robot to move higher payloads, thus increasing operational effectiveness.
Imagine you can redesign new jig and fixture without the need to cut a new mold, thus enabling faster changeover.

In collaboration with HP, SMF is organising a 3D for Packaging Round Table on 27th Nov, Fri, 2 – 4 pm @SMF Building.

Objective

We would like to share with you packaging used cases and how the recent HP-SMF MOU signing can benefit you.


We believe it will open up new possibilities for you to drive innovation and achieve business productivity.

Administrative Details

Please note that by registering for this event, your email may be recorded by the SMF and shared with associated partners for the purposes of marketing and promotions. Should you wish to withdraw your consent, please fill up the form here stating clearly in the subject line – “WITHDRAWAL OF PDPA CONSENT”.


Feel free to contact Mr Choi Kwok Keong at 6826 3112 for more information.

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